Our Applications

Low Silver Contents Adhesive

ACE34564C (Silver + Silver Coated Ceramic)，ACE34565M (Silver + Silver Coated Metal) are designed to perform electrically conductive die bonding adhesive，which is an alternative solution to provide cost effective semiconductor packaging applications. Its excellent rheological properties enable precise dispensing with a minimal adhesive amount and stable die placement，with no tailing or stringing observed during the dispensing process